Call for R2i papers

As previously mentioned, the third Research to Industry day, organised by the UK chapter of the International Microelectronics Assembly and Packaging Society (IMAPS UK), and supported by the IEEE, is taking place at the University of Sheffield on 3 September 2015.

The organisers are hoping for some EngD contributions, says Dr Anne Vanhoestenberghe. "You should submit a short (~200 words) abstract outlining your: research project, research portfolio or research facility that you would like to present to the industry in a short high-impact pitch at R2i." 

Abstracts should be emailed to: office@imaps.org.uk. The closing date for submission: 24 July 2015.

This event, previously attracting over 100 delegates, allows an industrial audience to meet and network with researchers active in the field of microelectronics assembly and packaging. This year's event will include keynotes from the different UK funding bodies (Innovate UK and research councils) to explain the different funding options available to the industry, and case studies illustrating the benefits of those schemes to the industrial partner. For more details or to register for the event, click here.